
| Overview |
| Service Field |

| Technology Strength |
| Maximum Layer: 40 | Maximum Pins: 60000 |
| Maximum Connection: 40000 | Minimum Via: 6mil(Laser Drilling 4mil) |
| Minimum Line Width: 3mil | Minimum Line Spacing: 3mil |
| Maximum BGAs / Board: 44 | Minimum BGA Pitch: 0.4mm |
| High Speed Differential Pairs: 10Gbps runs up to 30 inches |
Maximum BGA Pins: 2400 |
| Highest CPU Core Frequency: 3.6GHz | DDR/DDR2/DDR3/QDR/SRAM memory interface Switch Power Supply PCI, CPCI, PCI-X, PCIE, SATA, SATA II, XAUI ATCA / MicroTCA/AMC, Hyper Transport TI DLP-RAMBUS RDRAM |
| DSP Highest Core Frequency: 1.2GHz |
|
High Speed, Rules-Driven Designs / High Speed Digital Circuit / High Density / Analog Micro BGA / RF Design / Micro Vias / Backplane Signal Integrity Analysis / EMC Analysis DFM/DFT: Valor |
